File:DRIE Bosch process.png

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Summary

Description
English: Diagram of the Bosch process of w:Deep reactive-ion etching.
  1. Deposit and pattern masking layer (a).
  2. Etch
  3. Passivate
  4. Etch
  5. Structure after many etch steps
  6. After stripping passivation and mask. (b): Comb structure
Deutsch: Verfahrensschritte DRIE
  1. Auftragen und Strukturieren des Resist
  2. Ätzen
  3. Passivieren
  4. Ätzen
  5. Strukturtiefe erreicht
  6. Struktur nach dem Strippen von Resist und Passiverungssschicht. (b): Kammstruktur
Date (UTC)
Source Modification of de:Bild:Verfahrensschritte-DRIE.png
Author Gurgelgonzo (original), Smack (talk) (modification)
Permission
(Reusing this file)
Public domain
Other versions de:Bild:Verfahrensschritte-DRIE.png

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Public domain I, the copyright holder of this work, release this work into the public domain. This applies worldwide.
In some countries this may not be legally possible; if so:
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9 January 2007

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Date/TimeThumbnailDimensionsUserComment
current00:21, 9 January 2007Thumbnail for version as of 00:21, 9 January 2007172 × 637 (12 KB)Smack{{Information |Description= {{en|Diagram of the Bosch process of w:Deep reactive-ion etching. # Structure before etching. (a): Masking layer # Etch # Passivate # Etch # Structure after many etch steps # After stripping passivation and mask}} |Source=